PDC diamond cutter/diamond cutter head for floor preparation

PDC diamond cutters/diamond segments for floor preparationSynthetic diamond composite material: PDC is composed of polyctystalline diamond layer and cemented carbide substrate. it is kind of super-abrasive products sintered under super-high pressure and at high temperature. With excellent wear-ability and impact toughness,

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PDC diamond cutters/diamond segments for floor preparationSynthetic diamond composite material:

 

PDC is composed of polyctystalline diamond layer and cemented carbide substrate. it is kind of super-abrasive products sintered under super-high pressure and at high temperature. With excellent wear-ability and impact toughness, this very hard product mainly used for making roller cone bit for petroleum drilling and tools for coalmine drilling and geological drilling. Now two kinds of PDC are available: PDC for petroleum drilling & PDC for mining. The shape of interface can be flat or not. The range of thickness of polycrystalline diamond layer from 0.8mm to 3mm. And we cut PDC to different shape as per customer's requirement.

 

Specification:

Product 

Number

Diameter
(D)(mm)

Height
(T) (mm)

Diamond Thickness
(t) (mm)

Diamond 
Chamfer
(mm)

1308

13.44±0.03

8.00±0.10

2.30±0.20

0.30±0.10

1313

13.44±0.03

13.20±0.10

2.30±0.20

0.30±0.10

1608

15.88/16.00±0.03

8.00±0.10

2.30±0.20

0.30±0.10

1613

15.88/16.00±0.03

13.20±0.10

2.30±0.20

0.30±0.10

1908

19.05±0.05

8.00±0.10

2.30±0.20

0.30±0.10

1913

19.05±0.05

13.20±0.10

2.30±0.20

0.30±0.10

1916

19.05±0.05

16.31±0.10

2.30±0.20

0.30±0.10

4,Available size: (D*H)

0804, 0806, 0807, 0808, 0811

1004, 1008, 1016,

1117, 1118, 1204, 1217, 1218, 1219

1304, 1305, 1308, 1313, 1315, 1317, 1318, 1320

1418, 1419, 1520

1608, 1613, 1618, 1622, 1625, 1824

1908, 1913, 1916, 1919, 1920, 1925, 1929, 2428

PDC Diamond Cutters/Diamond Segments for Floor Preparation

The advantages of the new cutter is based on the improvement of the technology, which has completely updated in several factors: 
New Technology: 
1. The diamond powder is selected in a higher degree. 
2. Use a new type of tungsten carbide that different from JS cutters, which improved the strength character of bonding. 
3. The claws of the interface are changed to be net-grooves-shaped which formed by 20 straight vertical grooves, and the depth of the grooves are shallower. 
4. Improved the interior structure of the sintering cell that makes the pressure and temperature to be more uniform. It is very important for the PDC sintering. 
5. Use new super heat-resistant metal, to avoid being contaminative during sintering. 
6. Amended the sintering processing, and improved the bonding strength of the diamond-diamond key among the diamond layer. 
7. Increase the content of diamond, and increase the thickness of diamond layer up to 2.0mm.

PDC Diamond Cutters/Diamond Segments for Floor PreparationPDC Diamond Cutters/Diamond Segments for Floor PreparationPDC Diamond Cutters/Diamond Segments for Floor Preparation

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